Description
No descriptionConfiguration
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The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.Documents
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BESI / DATACON
2200 APM
Verified
CATEGORY
Die Sorters & Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79238
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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BESI / DATACON
2200 APM
CATEGORY
Die Sorters & Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79238
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.Documents
No documents