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ASM AD8912
    Description
    Die Bonder
    Configuration
    Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)
    OEM Model Description
    AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
    Documents

    No documents

    ASM

    AD8912

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    62756

    Wafer Sizes:

    12"/300mm

    Vintage:

    2004

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    ASM

    AD8912

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/5c07dd4b9f264bed87d2409cdd541223_3665895112cd491aba4d51a6983b6e9d45005c_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/d21691246b024b449de0ba8c39f18c56_66c5ac9e46c1487b88c73c353b4123f8_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/739514e8ab28455fa3f10a86d36e12bb_2e676a5202fd4e7e91531b011ff164761201a_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/98884d270524415fb21fdd45c6c465af_673ead9c18444eebbb4d8445bb16f50845005c_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    62756

    Wafer Sizes:

    12"/300mm

    Vintage:

    2004

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Die Bonder
    Configuration
    Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)
    OEM Model Description
    AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
    Documents

    No documents

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