Description
Die BonderConfiguration
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM Model Description
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.Documents
No documents
ASM
AD8912
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62756
Wafer Sizes:
12"/300mm
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD8912
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62756
Wafer Sizes:
12"/300mm
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die BonderConfiguration
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM Model Description
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.Documents
No documents