Skip to main content
ASM AD838L
    Have one like this?Sell it with Moov
    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:78399

    Wafer Sizes:Unknown

    Vintage:2017

    Description

    No description available

    Configuration

    No Configuration

    Documents
    No documents
    OEM Model Description

    The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.

    Available Services

    Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.

    • Money Back Guarantee

      Now free!

      Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more

    • Logistics

      One stop shop for Moov-ing equipment anywhere globally.

    • Insurance

      Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.

    • Refurbishment

      Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.