Description
Die bonderConfiguration
No ConfigurationOEM Model Description
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.Documents
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ASM
AD838L
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
58998
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die bonderConfiguration
No ConfigurationOEM Model Description
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.Documents
No documents