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    Key Item Details


    Operational Status:

    Product ID:71833

    Wafer Sizes:Unknown



    Die Bonder


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    OEM Model Description

    The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.

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