Used ASM AD838L for Sale

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AD838L

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Key Item Details

Condition:Used

Operational Status:

Product ID:72267

Wafer Sizes:Unknown

Vintage:2015

Description

Die Bonder

Configuration

No Configuration

Documents

No documents

OEM Model Description

The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.

ASM