Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The Esec 2100 sD advanced Die bonder is able to handle the most challenging thin die and warped strip packages. the proven "light & rigid" structure of the pick and place ensures highest accuracy and maximized throughput. Die BonderDocuments
No documents
BESI / ESEC
2100 sD advanced
Verified
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103547
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 sD advanced
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103547
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The Esec 2100 sD advanced Die bonder is able to handle the most challenging thin die and warped strip packages. the proven "light & rigid" structure of the pick and place ensures highest accuracy and maximized throughput. Die BonderDocuments
No documents