Description
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Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEM Model Description
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.Documents
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BESI / ESEC
2100 DS
Verified
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
30490
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllBESI / ESEC
2100 DS
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
30490
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEM Model Description
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.Documents
No documents