Description
Condition: Complete / No known issues Status: DeinstalledConfiguration
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM Model Description
Die BonderDocuments
No documents
BESI / ESEC
2008 xP
Verified
CATEGORY
Die Bonders
Last Verified: 23 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105323
Wafer Sizes:
Unknown
Vintage:
2004
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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BESI / ESEC
2008 xP
CATEGORY
Die Bonders
Last Verified: 23 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105323
Wafer Sizes:
Unknown
Vintage:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Condition: Complete / No known issues Status: DeinstalledConfiguration
BESI / ESEC 2008 xP Type D160 Heatable indexer - 3 heating zones (individually adjustable) 8’’ Cassette Handler 8’’ Wafer table Dispense unit Substrate, Dispense and Postbond Inspection. Magazine output Windows UpdateOEM Model Description
Die BonderDocuments
No documents