Description
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The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.Documents
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BESI / ESEC
2008 hS3 plus
Verified
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
27408
Wafer Sizes:
Unknown
Vintage:
Unknown
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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View AllBESI / ESEC
2008 hS3 plus
CATEGORY
Die Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
27408
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.Documents
No documents