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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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TRESKY 3002/3102
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    Documents

    No documents

    TRESKY

    3002/3102

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    21017


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    TRESKY

    3002/3102

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Over 60 days ago
    listing-photo-sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs/On7Gd3QHSgGvcDv1iTntKlLVoU0zxa9Kky21YJTu3VI_20200316_115641_f
    listing-photo-sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs/k77AyJKgf0rDLeRh7J6NmPt3ZvdRLcZ6C2heJYWuRiM_20200316_115641_f
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    21017


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    Documents

    No documents

    Similar Listings
    View All
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago