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TRESKY 3002/3102
  • TRESKY 3002/3102
  • TRESKY 3002/3102
Description
No description
Configuration
No Configuration
OEM Model Description
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
Documents

No documents

CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

66695


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TRESKY

3002/3102

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
listing-photo-6b2964e8cefd49ccb07b5a27bea8b71a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1903/6b2964e8cefd49ccb07b5a27bea8b71a/0fb3397edf754adbb42752b46eda41ea_8_mw.jpeg
listing-photo-6b2964e8cefd49ccb07b5a27bea8b71a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1903/6b2964e8cefd49ccb07b5a27bea8b71a/a7d4639c737c4d1897400fd0e070bd62_7_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

66695


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
Documents

No documents