Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.Documents
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NEWPORT
MRSI 505
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75362
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NEWPORT
MRSI 505
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75362
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.Documents
No documents