Overview

The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.