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BESI / ESEC 2100
    Description
    Flip Chip Attach
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.
    Documents

    No documents

    BESI / ESEC

    2100

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: 12 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Installed / Idle

    Product ID:

    116382

    Wafer Sizes:

    8"/200mm

    Vintage:

    2017

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    BESI / ESEC

    2100

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: 12 days ago
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/af887df36f384d679bb21807344d6731_886b5f005cd84502aa9c41c8edbd43fd_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/1e40cdad21144427bf21097f0ac23608_ddce73aec9a94d8f9e033ee6f2a24ab445005c_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/f7003879ce9a4195801cd4653795f7ff_dc4748d77d3341508b84133cd68affb8_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/0aaf0af07cea42238c61aed45f33651c_01e17bf7d94f4aaa8b8cd39bdba695cd45005c_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/58ec5ca2025d4ccc85bd6ff0c77a3c87_3200588c24574414b2ba19535430566645005c_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/9b88dabfe8bf4f91a3aaf58c5487ec33_460b2611ce9444acb8fc3e506256ad33_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/9e95b3ffaf514331abe7f3240fe6dd11_0f420e58dc7d47ab88fac1a7984af536_mw.jpeg
    listing-photo-82bfa8b687a54660b58adf3d7d6df135-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/82bfa8b687a54660b58adf3d7d6df135/8a9573b19b9341f7b72a3f65f9d5fe32_7e07d4289f74443cb75ffc0be7c4028345005c_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Installed / Idle

    Product ID:

    116382

    Wafer Sizes:

    8"/200mm

    Vintage:

    2017

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Flip Chip Attach
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.
    Documents

    No documents

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