Description
Flip Chip AttachConfiguration
No ConfigurationOEM Model Description
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.Documents
No documents
BESI / ESEC
2100
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116382
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2100
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116382
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip AttachConfiguration
No ConfigurationOEM Model Description
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.Documents
No documents