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BESI / ESEC 2100
    Description
    Flip Chip Attach
    Configuration
    Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFC
    OEM Model Description
    The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.
    Documents

    No documents

    BESI / ESEC

    2100

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: 12 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    116385

    Wafer Sizes:

    8"/200mm

    Vintage:

    2021

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / ESEC 2100

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    2100

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    Vintage: 2017Condition: Used
    Last Verified12 days ago
    BESI / ESEC 2100

    BESI / ESEC

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    BESI / ESEC 2100

    BESI / ESEC

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    BESI / ESEC 2100

    BESI / ESEC

    2100

    Die Bonders / Sorters / Attachers
    Vintage: 2017Condition: Used
    Last Verified12 days ago

    BESI / ESEC

    2100

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: 12 days ago
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/24c3ad4ec24b4aac97b8c547241537fb_505c532a12564cdab65df74b13c89733_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/77350c5c19f9460ab6cdffd88326e689_9f1aa8e64bbe4c6a8db0523505cde8a845005c_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/6c5db496b4d94120917144de317acbb8_4af6ac18ff7141658ef2dd0ff127dbcb45005c_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/d3f90f8a415c437b881d6c78e676a7e1_38511ba4ee2f4e5d81c5d55db7ef170f_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/bad24a19bb084aadb7bfdb7aa889bb80_557f53a4c3364d62b9da47399264657745005c_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/3ffa52cb6c3e4dc4bd8bb76ecdf229d5_5d8f146c1df3449ab17bc91da114217245005c_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/8f0c92fa21c049b8b79fff58b122917e_f21455cc9baf42c3b377f11b14bb96b1_mw.jpeg
    listing-photo-29edda95b35e40be8fe1447ee138d015-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1806/29edda95b35e40be8fe1447ee138d015/b2cdb9ce88f14641b3413e00d9f6de5c_e66ae2ae589a43e799a4067c83a609f4_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    116385

    Wafer Sizes:

    8"/200mm

    Vintage:

    2021

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Flip Chip Attach
    Configuration
    Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFC
    OEM Model Description
    The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2100

    BESI / ESEC

    2100

    Die Bonders / Sorters / AttachersVintage: 2017Condition: UsedLast Verified:12 days ago
    BESI / ESEC 2100

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    Die Bonders / Sorters / AttachersVintage: 2021Condition: UsedLast Verified:12 days ago
    BESI / ESEC 2100

    BESI / ESEC

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    Die Bonders / Sorters / AttachersVintage: 2017Condition: UsedLast Verified:12 days ago
    BESI / ESEC 2100

    BESI / ESEC

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    Die Bonders / Sorters / AttachersVintage: 2017Condition: UsedLast Verified:12 days ago