Description
Flip Chip AttachConfiguration
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM Model Description
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116385
Wafer Sizes:
8"/200mm
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
BESI / ESEC
2100
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116385
Wafer Sizes:
8"/200mm
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip AttachConfiguration
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM Model Description
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.Documents
No documents