2008 hS3 plus
Overview
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
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BESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days agoBESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days agoBESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days agoBESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days ago
BESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days agoBESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days agoBESI / ESEC
2008 hS3 plus
Die Bonders / Sorters / AttachersVintage: 2009Condition: UsedLast VerifiedOver 60 days ago