Description
Automatic Epoxy Die BondersConfiguration
No ConfigurationOEM Model Description
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
155115
Wafer Sizes:
Unknown
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2007 SSI plus
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
155115
Wafer Sizes:
Unknown
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Automatic Epoxy Die BondersConfiguration
No ConfigurationOEM Model Description
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.Documents
No documents