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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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BESI / ESEC 2007 SSI plus
    Description
    Soft Solder Die Bonder.
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.
    Documents

    No documents

    BESI / ESEC

    2007 SSI plus

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    27460


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / Attachers
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2007 SSI plus

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Over 60 days ago
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/41d68417ad3b47b69603e812e73d297e_89ce7694169b4d4193f15c0d0da27a3a45005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/31ef88515013432eb3deb287527a59e7_6e80209a728248ddaa391dff0161e4c445005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/82d8d05881aa477b8914eed167c07565_e96be70ce21e4d5ea4d6ffcbfef450ae45005c_f.jpeg
    listing-photo-92b65e3ad8ce472094fdf33c8f9331b2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/92b65e3ad8ce472094fdf33c8f9331b2/431b82197b6b4070b6a7abf8f3294274_4ff05612b51a4b388f82515b6446ca0545005c_f.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    27460


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Soft Solder Die Bonder.
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    BESI / ESEC 2007 SSI plus

    BESI / ESEC

    2007 SSI plus

    Die Bonders / Sorters / AttachersVintage: 0Condition: Parts ToolLast Verified:Over 60 days ago