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Description
ASM Twin832P DIE BONDConfiguration
No ConfigurationOEM Model Description
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
123876
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
TWIN832
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
123876
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ASM Twin832P DIE BONDConfiguration
No ConfigurationOEM Model Description
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.Documents
No documents