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ASM TWIN832
  • ASM TWIN832
  • ASM TWIN832
  • ASM TWIN832
Description
ASM Twin832P DIE BOND
Configuration
No Configuration
OEM Model Description
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: 24 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

123876


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASM

TWIN832

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 24 days ago
listing-photo-64017252151d45d39605ed0919cddf15-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

123876


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ASM Twin832P DIE BOND
Configuration
No Configuration
OEM Model Description
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.
Documents

No documents