
Description
AD838L-G2 Never put into production.Configuration
Die Bonder With: - 4 inch waffle pack holder - 2 inch waffle pack holder - 8 inch ring expander - Spare parts kit from OEM - Has a high force bond headOEM Model Description
Automatic Die Attach System Accuracy ± 10 µm @ 3s Dual epoxy stamping / dispensing process Direct ceramic substrate indexingDocuments
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AD838L-G2
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127003
Wafer Sizes:
Unknown
Vintage:
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available