Description
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAAConfiguration
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEM Model Description
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.Documents
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TEL / TOKYO ELECTRON
TRIASe+ EX-II TiN
Verified
CATEGORY
Deposition
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114272
Wafer Sizes:
12"/300mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
TRIASe+ EX-II TiN
CATEGORY
Deposition
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114272
Wafer Sizes:
12"/300mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAAConfiguration
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEM Model Description
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.Documents
No documents