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LAM RESEARCH / NOVELLUS ALTUS DirectFill MAX
    Description
    W
    Configuration
    W
    OEM Model Description
    ALTUS DirectFill is a tungsten nitride/tungsten deposition system designed for advanced contact and via-fill applications at 65 nm and below. It simplifies the tungsten deposition process by replacing the standard multi-tool Ti/TiN/W approach with a single three-module system. The advanced plug-fill technology of ALTUS DirectFill can reduce contact resistance and lower the overall cost of ownership by 50% or more when compared to existing processes. This makes it a cost-effective and efficient solution for advanced contact and via-fill applications.
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    LAM RESEARCH / NOVELLUS

    ALTUS DirectFill MAX

    verified-listing-icon

    Verified

    CATEGORY

    Deposition
    Last Verified: 26 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    76021

    Wafer Sizes:

    12"/300mm

    Vintage:

    2003

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    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    LAM RESEARCH / NOVELLUS

    ALTUS DirectFill MAX

    verified-listing-icon

    Verified

    CATEGORY

    Deposition
    Last Verified: 26 days ago
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    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    76021

    Wafer Sizes:

    12"/300mm

    Vintage:

    2003

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    W
    Configuration
    W
    OEM Model Description
    ALTUS DirectFill is a tungsten nitride/tungsten deposition system designed for advanced contact and via-fill applications at 65 nm and below. It simplifies the tungsten deposition process by replacing the standard multi-tool Ti/TiN/W approach with a single three-module system. The advanced plug-fill technology of ALTUS DirectFill can reduce contact resistance and lower the overall cost of ownership by 50% or more when compared to existing processes. This makes it a cost-effective and efficient solution for advanced contact and via-fill applications.
    Documents

    No documents

    Similar Listings
    View All
    LAM RESEARCH / NOVELLUS ALTUS DirectFill MAX
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    LAM RESEARCH / NOVELLUS ALTUS DirectFill MAX
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    LAM RESEARCH / NOVELLUS ALTUS DirectFill MAX
    LAM RESEARCH / NOVELLUS
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    DepositionVintage: 2001Condition: UsedLast Verified: 26 days ago