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Description
Automated Defect InspectionConfiguration
Auto - NSX Automated Wafer Handling System - Xandex 350-0002 Pneumatic Die Marker Controller - Objectives: 1, 2, 5, 10, 20x - Manuals / CD / Floppy Disk - PC - Monitor - Keyboard and MouseOEM Model Description
The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.Documents
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Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60613
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60613
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Automated Defect InspectionConfiguration
Auto - NSX Automated Wafer Handling System - Xandex 350-0002 Pneumatic Die Marker Controller - Objectives: 1, 2, 5, 10, 20x - Manuals / CD / Floppy Disk - PC - Monitor - Keyboard and MouseOEM Model Description
The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.Documents
No documents