Overview

The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.