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6" Fab For Sale from Moov - Click Here to Learn More
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ONTO / RUDOLPH / AUGUST NSX-320
    Description
    MACRO DEFECT INSPECTOR
    Configuration
    No Configuration
    OEM Model Description
    The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.
    Documents

    No documents

    ONTO / RUDOLPH / AUGUST

    NSX-320

    verified-listing-icon

    Verified

    CATEGORY
    Defect Inspection

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112881


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    ONTO / RUDOLPH / AUGUST NSX-320

    ONTO / RUDOLPH / AUGUST

    NSX-320

    Defect Inspection
    Vintage: 0Condition: Used
    Last Verified10 days ago

    ONTO / RUDOLPH / AUGUST

    NSX-320

    verified-listing-icon
    Verified
    CATEGORY
    Defect Inspection
    Last Verified: Over 60 days ago
    listing-photo-c00a7d51f59142938efc3c686a978ceb-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112881


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    MACRO DEFECT INSPECTOR
    Configuration
    No Configuration
    OEM Model Description
    The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.
    Documents

    No documents

    Similar Listings
    View All
    ONTO / RUDOLPH / AUGUST NSX-320

    ONTO / RUDOLPH / AUGUST

    NSX-320

    Defect InspectionVintage: 0Condition: UsedLast Verified:10 days ago
    ONTO / RUDOLPH / AUGUST NSX-320

    ONTO / RUDOLPH / AUGUST

    NSX-320

    Defect InspectionVintage: 0Condition: UsedLast Verified:Over 60 days ago