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200mm and 300mm wafer, system includes integrated 3D metrology that enables specialized measurements critical to the TSV process. NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as interconnects. The system measures film thickness (polymers, photoresist, glass), thin remaining silicon thickness, surface topography, and copper pillar and solder bump height. The advanced wafer-level packaging configuration adds measurements of the wafer profile (warp and bow), total stack thickness and thick/thin remaining silicon thickness (bonded wafer before and after grind).

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