Description
No descriptionConfiguration
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The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.Documents
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ONTO / RUDOLPH / AUGUST
NSX-320
Verified
CATEGORY
Defect Inspection
Key Item Details
Condition:
Used
Operational Status:
Installed / Down
Product ID:
68071
Wafer Sizes:
Unknown
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-320
Verified
CATEGORY
Defect Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Down
Product ID:
68071
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.Documents
No documents