Description
Tencor Viper 2410 Macro Defect Inspection - Replacing the manual bright light macro defect inspection performed by operators. - Automated detection, classification and reporting of all yield- critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. - With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing disposition decisions to be made quickly and accurately, dramatically reducing scrap and preventing further investment in low-yielding wafers.Configuration
WorkingOEM Model Description
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KLA
VIPER 2410
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55832
Wafer Sizes:
8"/200mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
VIPER 2410
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55832
Wafer Sizes:
8"/200mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Tencor Viper 2410 Macro Defect Inspection - Replacing the manual bright light macro defect inspection performed by operators. - Automated detection, classification and reporting of all yield- critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. - With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing disposition decisions to be made quickly and accurately, dramatically reducing scrap and preventing further investment in low-yielding wafers.Configuration
WorkingOEM Model Description
None ProvidedDocuments
No documents