Description
Wafer Inspection SystemConfiguration
- Software version: NGS 5.4 SR03 HF03 - Power rating: 208V3W-N - Loading configuration: 3 - Possible damage to chuck area due to a wafer breakage event - HDD removedOEM Model Description
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.Documents
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KLA
SURFSCAN SP2
Verified
CATEGORY
Defect Inspection
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
100909
Wafer Sizes:
12"/300mm
Vintage:
2010
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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View AllKLA
SURFSCAN SP2
Verified
CATEGORY
Defect Inspection
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
100909
Wafer Sizes:
12"/300mm
Vintage:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer Inspection SystemConfiguration
- Software version: NGS 5.4 SR03 HF03 - Power rating: 208V3W-N - Loading configuration: 3 - Possible damage to chuck area due to a wafer breakage event - HDD removedOEM Model Description
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.Documents
No documents