Overview

The AIT XP is a high-throughput scanning product for patterned wafer inspection that adjusts dynamically to all die regions, delivering maximum sensitivity and improved detection of killer defects. It features faster recipe setup, improved recipe robustness, and user-friendly setup templates. It enables improved cost of ownership and extends a fab’s inspection capability. The 23xx series, the AIT series, and the eS30 form part of a KLA-Tencor strategy that combines inspection technologies to offer fabs a new, customized strategy for capturing and controlling defects. KLA-Tencor delivers an overall defect-control solution through a comprehensive range of defect reduction and control technology.