Description
- PIC function (Pocket Integrity Check) Include yes - Include HDDConfiguration
No ConfigurationOEM Model Description
The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.Documents
No documents
KLA
T830
Verified
CATEGORY
Defect Inspection
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116524
Wafer Sizes:
Unknown
Vintage:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
T830
CATEGORY
Defect Inspection
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116524
Wafer Sizes:
Unknown
Vintage:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
- PIC function (Pocket Integrity Check) Include yes - Include HDDConfiguration
No ConfigurationOEM Model Description
The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.Documents
No documents