Overview

Support φ100 mm, φ150 mm, φ200 mm patterned/ non-patterned wafer. DI2800 uses scattering-intensity simulation technology to optimize the illumination and detection optics, enabling highly sensitive inspection of patterned-wafer defects developed during the manufacturing process. It has a detection sensitivity of 0.1-μm standard particle size on mirrored wafers. This makes it possible to examine even the incredibly small, 0.3-mm square size chips used in semiconductor devices in the IoT and automotive fields, with optimization of the inspection sequence enabling a defect inspection speed of over forty 200-mm wafer sheets per hour.