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APPLIED MATERIALS (AMAT) UVISION 3
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    Documents

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    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon

    Verified

    CATEGORY
    Defect Inspection

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    29600


    Wafer Sizes:

    Unknown


    Vintage:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect Inspection
    Vintage: 2008Condition: Used
    Last VerifiedOver 60 days ago

    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon
    Verified
    CATEGORY
    Defect Inspection
    Last Verified: Over 60 days ago
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/fab17a979f3e4150bdbb7b2e92b7ed13_e0854bf525744efea37d18510564f2e11201a_mw.jpeg
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/40e6486bc1bc41c9bc6899f68c82ae3b_f963d8d9f7804f8b8e3ae9832132e360_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/377d0ef24f6345b0881cdfc7b81ecf2a_fa702103fe3c46c69ee89d9fd7377512_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/50b00f6d770e4010b104990f8f309269_b31d9624ecb5402eac0965280dc148b6_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    29600


    Wafer Sizes:

    Unknown


    Vintage:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    Documents

    No documents

    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect InspectionVintage: 2008Condition: UsedLast Verified:Over 60 days ago