Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
APPLIED MATERIALS (AMAT) SEMVISION CX 300
    Description
    No description
    Configuration
    THROUGHPUT -Measured using AMAT standard wafer and throughput BKMs: On AMAT reference wafer. - Wafer Overhead (In pipeline mode): 90 s - Defect throughput (single wafer): 500 DPH ( Option for 600 DPH ) - Wafer throughput (50 defects/wafer): 8 wafers/hr - Wafer breakage: More then 10000 runs REDETECTION Bare: - Redetection success rate (defects > 0.15 mm): 90% - Redetection Reproducibility: 95% Pattern: - Redetection success rate (defects > 0.15 mm): 90% - Redetection Reproducibility: 95% AUTOMATIC DEFECT CLASSIFICATION - Classification Global Accuracy: 80% - Classification Reproducibility: 90% BARE WAFER REVIEW AND CLASSIFICATION - Throughput for review and ADC: 6 wafer/hour (20 defects/wafer) - Throughput for review and material ID: 160 defs/hr (Typical Acquisition Time): 10s RECIPE PROGRAMMING Time to New ADR Recipe (existing layer, New product): 20 min - Time to New ADC Recipe: 2.0 Hours Defect files type: All SEM - Resolution: 4 nm @ 1 kV (0° tilt) - Accelerating Voltage: 500V – 15kV - Magnification: x500-x200,000 - Multi perspective SEM image: Yes - High Aspect Ratio: N/A - Auto focus: Yes IMAGE STABILITY - Gun Life Time: >1 Year - Gun Bake Out Frequency: 6-12 Months - Prob current monitor system: Yes OPTICAL MICROSCOPE Color - Magnification: X2.5, X20, X100 STAGE - X, Y Coordinates Accuracy (@ 0° tilt): +1.5μm - Tilt (3 Discrete positions): 0°, 15°, 45o Discrete tilting - Tilt Position Exchange Time: 35 s - Tilt Eccentricity: +10 μm - Rotating: 0°, 45°, 90o , 180o Discrete rotating API & VOLTAGE CONTRAST -Voltage Contrast Redetection and ADC: Redetection rate > 90% for filled structure and structures with Aspect Ratio up to 1:3 ADC allows classification of Voltage Contrast according to gray level. -API (Automatic Process Control): +/-1.5umAll relevant ADR and ADC specifications apply to the API application. EDX -Typical Acquisition Time: 10 s - Resolution: Mn 138.4 eV +2.5 - Resolution: Si 91 eV +2.0 - Resolution: F 81.5 eV +2.0 CLEANLINESS - Class 1 clean room compatible - Front Side Wafer: 0.013 PWP/cm² @> 0.12 μm - Back Side Wafer: 0.14 PWP/cm2@> 1 mm IMAGE STORAGE: More then 10,000 - Image format: TIF HANDLING YIELD: 99.99% UPTIME: 0-6 months after acceptance: 93%, 6 months plus: 95% MTBF: 0-6 months after acceptance: 750hr, 6 months plus: 1000hr MTBA: 0-6 months after acceptance: 60hr, 6 months plus: 100hr PM: 3.75 hr/ week MTTR: 6hr
    OEM Model Description
    None Provided
    Documents

    No documents

    APPLIED MATERIALS (AMAT)

    SEMVISION CX 300

    verified-listing-icon

    Verified

    CATEGORY
    Defect Inspection

    Last Verified: Over 30 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Deinstalled


    Product ID:

    113459


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) SEMVISION CX 300

    APPLIED MATERIALS (AMAT)

    SEMVISION CX 300

    Defect Inspection
    Vintage: 0Condition: Used
    Last VerifiedOver 30 days ago

    APPLIED MATERIALS (AMAT)

    SEMVISION CX 300

    verified-listing-icon
    Verified
    CATEGORY
    Defect Inspection
    Last Verified: Over 30 days ago
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/d07ba98b9ad34e5bb3535eee9b656021_fbded51721ee4558b8db148981a9c3ca_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/e0e368a1659849bca9f46c1da072b42e_c53e2298ad304fbe93d505aae67d8a3c_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/7784b5f9dc4a4e429877a3cd11b28c87_41d344c5ad6f4b27aaef078104af0920_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/d0fe8ec249934b6dacdb5dbc6fb1594a_8fb3eb2bab124b33970a112f1bb9c52f_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/103a8141cb554d0aba7a24a823b96935_88e2ecac9c25454a943d403d08782ca7_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/9f18fe3cbd5d48deb0f0ad173a1e04b1_155f8ec8dd99469cb93c2f72054b5437_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/4e3746c4060a4ac8853dc7fcda619bd8_d4db4e510dae459d903e645316dbf3c2_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/89b6e7cc2ab241529d2e5c53743a9f32_d7aa6ef132e140b4945a932c07723b74_mw.jpeg
    listing-photo-bd089e4611064d6bab0f9c4c91468a25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76223/bd089e4611064d6bab0f9c4c91468a25/cb64c9570cd2440d9a8103a976adf0fc_64a1d24af70c4fe0ac53f0545db3ef18_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Deinstalled


    Product ID:

    113459


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    THROUGHPUT -Measured using AMAT standard wafer and throughput BKMs: On AMAT reference wafer. - Wafer Overhead (In pipeline mode): 90 s - Defect throughput (single wafer): 500 DPH ( Option for 600 DPH ) - Wafer throughput (50 defects/wafer): 8 wafers/hr - Wafer breakage: More then 10000 runs REDETECTION Bare: - Redetection success rate (defects > 0.15 mm): 90% - Redetection Reproducibility: 95% Pattern: - Redetection success rate (defects > 0.15 mm): 90% - Redetection Reproducibility: 95% AUTOMATIC DEFECT CLASSIFICATION - Classification Global Accuracy: 80% - Classification Reproducibility: 90% BARE WAFER REVIEW AND CLASSIFICATION - Throughput for review and ADC: 6 wafer/hour (20 defects/wafer) - Throughput for review and material ID: 160 defs/hr (Typical Acquisition Time): 10s RECIPE PROGRAMMING Time to New ADR Recipe (existing layer, New product): 20 min - Time to New ADC Recipe: 2.0 Hours Defect files type: All SEM - Resolution: 4 nm @ 1 kV (0° tilt) - Accelerating Voltage: 500V – 15kV - Magnification: x500-x200,000 - Multi perspective SEM image: Yes - High Aspect Ratio: N/A - Auto focus: Yes IMAGE STABILITY - Gun Life Time: >1 Year - Gun Bake Out Frequency: 6-12 Months - Prob current monitor system: Yes OPTICAL MICROSCOPE Color - Magnification: X2.5, X20, X100 STAGE - X, Y Coordinates Accuracy (@ 0° tilt): +1.5μm - Tilt (3 Discrete positions): 0°, 15°, 45o Discrete tilting - Tilt Position Exchange Time: 35 s - Tilt Eccentricity: +10 μm - Rotating: 0°, 45°, 90o , 180o Discrete rotating API & VOLTAGE CONTRAST -Voltage Contrast Redetection and ADC: Redetection rate > 90% for filled structure and structures with Aspect Ratio up to 1:3 ADC allows classification of Voltage Contrast according to gray level. -API (Automatic Process Control): +/-1.5umAll relevant ADR and ADC specifications apply to the API application. EDX -Typical Acquisition Time: 10 s - Resolution: Mn 138.4 eV +2.5 - Resolution: Si 91 eV +2.0 - Resolution: F 81.5 eV +2.0 CLEANLINESS - Class 1 clean room compatible - Front Side Wafer: 0.013 PWP/cm² @> 0.12 μm - Back Side Wafer: 0.14 PWP/cm2@> 1 mm IMAGE STORAGE: More then 10,000 - Image format: TIF HANDLING YIELD: 99.99% UPTIME: 0-6 months after acceptance: 93%, 6 months plus: 95% MTBF: 0-6 months after acceptance: 750hr, 6 months plus: 1000hr MTBA: 0-6 months after acceptance: 60hr, 6 months plus: 100hr PM: 3.75 hr/ week MTTR: 6hr
    OEM Model Description
    None Provided
    Documents

    No documents

    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) SEMVISION CX 300

    APPLIED MATERIALS (AMAT)

    SEMVISION CX 300

    Defect InspectionVintage: 0Condition: UsedLast Verified:Over 30 days ago