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TEL / TOKYO ELECTRON MB2-730 HT-HT
  • TEL / TOKYO ELECTRON MB2-730 HT-HT
  • TEL / TOKYO ELECTRON MB2-730 HT-HT
  • TEL / TOKYO ELECTRON MB2-730 HT-HT
Description
No description
Configuration
CVD SYSTEM, 2 CHAMBER WSi Process
OEM Model Description
Chemical vapor deposition (CVD) system designed for tungsten (W) and tungsten silicide (WSi) processes on 200-mm wafers. It features two process chambers and is optimized for electrode and wiring manufacturing. The system employs a ramp heating method, allowing it to accommodate products requiring different temperature zones, making it suitable for low-volume, multi-product manufacturing. Additionally, it utilizes plasma-free dry cleaning with chlorine trifluoride (ClF₃), which extends wet cleaning cycles and reduces running costs.
Documents

No documents

CATEGORY
CVD

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

56416


Wafer Sizes:

Unknown


Vintage:

1996


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TEL / TOKYO ELECTRON

MB2-730 HT-HT

verified-listing-icon
Verified
CATEGORY
CVD
Last Verified: Over 60 days ago
listing-photo-610bf63d670a47e9888fa68f90aff81a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

56416


Wafer Sizes:

Unknown


Vintage:

1996


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
CVD SYSTEM, 2 CHAMBER WSi Process
OEM Model Description
Chemical vapor deposition (CVD) system designed for tungsten (W) and tungsten silicide (WSi) processes on 200-mm wafers. It features two process chambers and is optimized for electrode and wiring manufacturing. The system employs a ramp heating method, allowing it to accommodate products requiring different temperature zones, making it suitable for low-volume, multi-product manufacturing. Additionally, it utilizes plasma-free dry cleaning with chlorine trifluoride (ClF₃), which extends wet cleaning cycles and reduces running costs.
Documents

No documents