Description
No descriptionConfiguration
AMAT P5000 PECVD -Films required SiO2 and SiNx -Stress controlled, tensile to compressive -SiH4 based chemistries -RF Clean system for chamber clean -Mainframe 150mm, SNNF wafers, through the wall fit -Storage Elevator. Robot, cassette handling -Dual Frequency RF for Stress Control -RF Clean system and chemistry Chambers A - xL PE Delta Nitride OEM setup for standard films B - xL PE Delta Nitride OEM setup for standard films -New process kits -fully rebuilt and tested gas box with MFC's -fully calibrated RF and PSU components all system interconnect and Heat exchangers AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
No documents
APPLIED MATERIALS (AMAT)
P5000 CVD
Verified
CATEGORY
CVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103697
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
APPLIED MATERIALS (AMAT)
P5000 CVD
CATEGORY
CVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103697
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
AMAT P5000 PECVD -Films required SiO2 and SiNx -Stress controlled, tensile to compressive -SiH4 based chemistries -RF Clean system for chamber clean -Mainframe 150mm, SNNF wafers, through the wall fit -Storage Elevator. Robot, cassette handling -Dual Frequency RF for Stress Control -RF Clean system and chemistry Chambers A - xL PE Delta Nitride OEM setup for standard films B - xL PE Delta Nitride OEM setup for standard films -New process kits -fully rebuilt and tested gas box with MFC's -fully calibrated RF and PSU components all system interconnect and Heat exchangers AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
No documents