Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Lam developed the Teres CMP integrated polishing and cleaning system based on a technological approach different from that of conventional polishers which utilize a rotating table and rotating polishing heads. Lam has developed a proprietary linear polishing method and has designed its polishing system to be installed in a Class 1 cleanroom environment to planarize patterned films on wafers, and to polish wafers at higher rates and achieve the uniformity and planarity that is necessary to manufacture advanced semiconductor devices.Documents
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Verified
CATEGORY
CMP
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
141201
Wafer Sizes:
8"/200mm
Vintage:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
TERES
CATEGORY
CMP
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
141201
Wafer Sizes:
8"/200mm
Vintage:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Lam developed the Teres CMP integrated polishing and cleaning system based on a technological approach different from that of conventional polishers which utilize a rotating table and rotating polishing heads. Lam has developed a proprietary linear polishing method and has designed its polishing system to be installed in a Class 1 cleanroom environment to planarize patterned films on wafers, and to polish wafers at higher rates and achieve the uniformity and planarity that is necessary to manufacture advanced semiconductor devices.Documents
No documents