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DISCO DFP8141
  • DISCO DFP8141
  • DISCO DFP8141
  • DISCO DFP8141
Description
No description
Configuration
No Configuration
OEM Model Description
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
CMP

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

112290


Wafer Sizes:

Unknown


Vintage:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

DISCO

DFP8141

verified-listing-icon
Verified
CATEGORY
CMP
Last Verified: Over 60 days ago
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/49212bf109974ae3938bc87dbf291a06_screenshot20240902at3_mw.png
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/a0090fd10e924898a34c080944707abd_screenshot20240902at3_mw.png
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/4d8f40506fd943bc83df46cbd8262bd4_screenshot20240902at3_mw.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

112290


Wafer Sizes:

Unknown


Vintage:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
Documents

No documents