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Chemical & Mechanical PolishingOEM Model Description
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.Documents
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APPLIED MATERIALS (AMAT)
REFLEXION GT
Verified
CATEGORY
CMP
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
100904
Wafer Sizes:
Unknown
Vintage:
2011
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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APPLIED MATERIALS (AMAT)
REFLEXION GT
Verified
CATEGORY
CMP
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
100904
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Chemical & Mechanical PolishingOEM Model Description
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.Documents
No documents
Similar Listings
View AllNo Similar Listings