Description
Chemical & Mechanical PolishingConfiguration
No ConfigurationOEM Model Description
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.Documents
No documents
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127531
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
REFLEXION GT
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127531
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Chemical & Mechanical PolishingConfiguration
No ConfigurationOEM Model Description
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.Documents
No documents