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APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
Description
No description
Configuration
Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
OEM Model Description
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
Documents
CATEGORY
CD-SEM

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

78760


Wafer Sizes:

12"/300mm


Vintage:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

VERASEM 3D

verified-listing-icon
Verified
CATEGORY
CD-SEM
Last Verified: Over 60 days ago
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Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

78760


Wafer Sizes:

12"/300mm


Vintage:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
OEM Model Description
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
Documents