The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

VERASEM 3D

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Configuration - VeraSem 3D.pdf

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Configuration  -  VeraSem 3D.pdf

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