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TRESKY 3002/3102
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer
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    TRESKY

    3002/3102

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    16458

    Wafer Sizes:

    8"/200mm

    Vintage:

    Unknown

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    Similar Listings
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    TRESKY 3002/3102
    TRESKY3002/3102Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    TRESKY 3002/3102
    TRESKY3002/3102Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    TRESKY 3002/3102
    TRESKY3002/3102Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    TRESKY

    3002/3102

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/XAQwjaY1Ybp10Xm_TYbFwgwBe3mzWkB4ARqcQT03-6c_20200316_115514_f
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/Z8s9Hr7WYtuliFsQ9JZOFFnv5TANAEdACfITp3pmE9s_20200316_115514_f
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    16458

    Wafer Sizes:

    8"/200mm

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer
    Documents

    No documents

    Similar Listings
    View All
    TRESKY 3002/3102
    TRESKY
    3002/3102
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    TRESKY 3002/3102
    TRESKY
    3002/3102
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    TRESKY 3002/3102
    TRESKY
    3002/3102
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago