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SHINKAWA SPA 300 SUPER
    Description
    No description
    Configuration
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    OEM Model Description
    The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).
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    SHINKAWA

    SPA 300 SUPER

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98530


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    SHINKAWA SPA 300 SUPER
    SHINKAWASPA 300 SUPERBonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    SHINKAWA

    SPA 300 SUPER

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-7eec29a4a1c646f7830d7aacab35921d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98530


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).
    Documents

    No documents

    Similar Listings
    View All
    SHINKAWA SPA 300 SUPER
    SHINKAWA
    SPA 300 SUPER
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    SHINKAWA SPA 300 SUPER
    SHINKAWA
    SPA 300 SUPER
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    SHINKAWA SPA 300 SUPER
    SHINKAWA
    SPA 300 SUPER
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago