Description
No descriptionConfiguration
No ConfigurationOEM Model Description
MCU 3000 is used to temporary bond and de-bond the device wafer with our T-ESC´s. It is suited to low volume or R&D production, a trained operator can achieve between 15-25 bonds and de-bonds per hour.Documents
No documents
PROTEC
MCU 3000
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76414
Wafer Sizes:
Unknown
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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View AllPROTEC
MCU 3000
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76414
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
MCU 3000 is used to temporary bond and de-bond the device wafer with our T-ESC´s. It is suited to low volume or R&D production, a trained operator can achieve between 15-25 bonds and de-bonds per hour.Documents
No documents