Description
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MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.Documents
PANASONIC
MD-P200
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75482
Wafer Sizes:
Unknown
Vintage:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PANASONIC
MD-P200
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75482
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available