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NEWPORT MRSI 605
    Description
    No description
    Configuration
    -Unit is in a 505 Chassis. Has the accuracy and software of a 605.
    OEM Model Description
    Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.
    Documents

    No documents

    NEWPORT

    MRSI 605

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 30 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    44355

    Wafer Sizes:

    Unknown

    Vintage:

    2001

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    NEWPORT MRSI 605
    NEWPORTMRSI 605Bonders
    Vintage: 2001Condition: Used
    Last VerifiedOver 30 days ago

    NEWPORT

    MRSI 605

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 30 days ago
    listing-photo-af9baafb98764ebfbe778894e9387bc5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/af9baafb98764ebfbe778894e9387bc5/1d93bc15d5f04edfba5e068fe65ad9f3_1f0862ecc5894fa596c29a68a7bf42181201a_mw.jpeg
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    listing-photo-af9baafb98764ebfbe778894e9387bc5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/af9baafb98764ebfbe778894e9387bc5/8e2b33f2d9f34c1db5f0c01d6e196ab3_075efb51a8344634bb9be87303c6a63d_mw.jpeg
    listing-photo-af9baafb98764ebfbe778894e9387bc5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/af9baafb98764ebfbe778894e9387bc5/d1dc5e95373e4e95afd975babed80292_c00dbb0add1043079ecb09732c2de811_mw.jpeg
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    listing-photo-af9baafb98764ebfbe778894e9387bc5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/af9baafb98764ebfbe778894e9387bc5/55389f2337a24d0a83856cd005e1d285_ad2867d19c7b4b5ab62530fe505e52e8_mw.jpeg
    listing-photo-af9baafb98764ebfbe778894e9387bc5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/af9baafb98764ebfbe778894e9387bc5/324ffdd447bb41d6bbdedf18b6d4e449_98d3fa598c4c49ca83e50449ec54ff0d1201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    44355

    Wafer Sizes:

    Unknown

    Vintage:

    2001

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    -Unit is in a 505 Chassis. Has the accuracy and software of a 605.
    OEM Model Description
    Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.
    Documents

    No documents

    Similar Listings
    View All
    NEWPORT MRSI 605
    NEWPORT
    MRSI 605
    BondersVintage: 2001Condition: UsedLast Verified: Over 30 days ago