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NEWPORT MRSI 605
    Description
    No description
    Configuration
    Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.
    OEM Model Description
    Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.
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    NEWPORT

    MRSI 605

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    23191

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    Logistics Support
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    NEWPORT MRSI 605
    NEWPORTMRSI 605Bonders
    Vintage: 2001Condition: Used
    Last VerifiedOver 30 days ago

    NEWPORT

    MRSI 605

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE/14M9C0el3LQ9wChEFubd6paSESCixBS4WCHcYRYQg5Q_20190301_115129_f
    listing-photo-Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE/yM9B5scMXV1_3PUKNu7duVCLiCprPJqDrE-efn766Oo_20190301_115129_f
    listing-photo-Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE/aC3wPZQ2yGK1wlCEGrNt38TEdQDzHPuUZZJOV68cqIg_20190301_115129_f
    listing-photo-Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Ye-dfyxKMwdXaquwjqwrAxMNwweUA7kEzL0EmIO6UQE/sVzqpQ9YLhYoEe923lg8cYqcNOXnWNh9hRdQh5Ngmkg_20190301_115129_f
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    23191

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.
    OEM Model Description
    Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.
    Documents

    No documents

    Similar Listings
    View All
    NEWPORT MRSI 605
    NEWPORT
    MRSI 605
    BondersVintage: 2001Condition: UsedLast Verified: Over 30 days ago